i.MX RT1060: Crossover MCU with Arm® Cortex®-M7

i.MX-RT1060 Active

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i.MX RT1060 Crossover MCUs are based on the Arm®Cortex®-M7 core for real-time microcontroller performance and high integration for industrial and IoT applications.

The i.MX RT1060 Arm®Cortex®-M7 operates at up to 600 MHz with 1 MB on-chip RAM. The family offers 2D graphics, camera, various memory interfaces and a wide range of connectivity interfaces including UART, SPI, I²C, USB, 2x 10/100M Ethernet, and 3x CAN. Additional features for real-time applications include high-speed GPIO, CAN FD and synchronous parallel NAND/NOR/PSRAM controller. The i.MX RT1060 provides additional flexibility with 225BGA, 196BGA packages and an extended temperature range of up to 125°C.

The i.MX RT1060 family is supported by the MCUXpresso ecosystem, which includes an SDK, a choice of IDEs and secure provisioning and configuration tools to enable rapid development.

Block Diagram

i.MX RT1060 Crossover MCU

i.MX RT1060 Crossover MCU
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Features

  • Highest performing Arm Cortex-M7
  • 3020 CoreMark/1284 DMIPS @ 600 MHz
  • 1MB On-Chip SRAM - up to 512KB configurable as tightly coupled memory (TCM)
  • Real-time, low-latency response as low as 20 ns
  • MCUXpresso suite of software and tools
    • Selection of IDE choices
    • Pin, clock, peripheral, security and memory config tools
    • Security programming and provisioning tools
    • Software development kit (SDK)
  • Zephyr RTOS support
  • Industry’s lowest dynamic power with an integrated DC-DC converter
  • Low-power run modes at 24MHz
  • Advanced multimedia for GUI and enhanced HMI
    • 2D graphics acceleration engine
    • Parallel camera sensor interface
    • LCD display controller (up to WXGA 1366x768)
    • 3x I²S for high-performance, multi-channel audio
  • Extensive external memory interface options
    • NAND, eMMC, QuadSPI NOR Flash, and Parallel NOR Flash
  • Wireless connectivity interface for
    • Wi-Fi®, Bluetooth®, Bluetooth Low Energy, ZigBee® and Thread™
  • Available in 169 BGA (9x9 mm, 11x11 mm) and 225 BGA (13x13 mm) packages
  • Robust extended industrial qualification (-40°C to 125°C) for 225 BGA package

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